| Quantity: | |
|---|---|
Metal
TOYOE
| We are developing a cutting-edge 3D visualization system, which features a dual-core hardware configuration designed for high-precision spatial management. On one hand, UWB (Ultra-Wideband) chips are integrated into containers—these chips leverage ultra-wideband positioning technology to capture real-time, fine-grained location data of the containers. On the other hand, high-definition 4K monitors serve as the core display terminal, ensuring that the spatial information of the containers is presented with clear, detailed visuals, laying a solid foundation for accurate spatial coordination |
The synergy between UWB chips and 4K monitors endows the 3D visualization system with outstanding performance: the UWB chips enable centimeter-accurate positioning of each container, accurately capturing their spatial coordinates, movement trajectories, and placement status in real time. This precise data is then seamlessly translated into intuitive 3D visuals on the 4K monitors, allowing managers to clearly grasp the overall spatial layout of the containers at a glance. Ultimately, the system realizes efficient, accurate spatial coordination and management of containers, suitable for scenarios such as warehouse inventory scheduling and logistics yard operation optimization
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| The much-anticipated intelligent route optimization function allows supply chain partners to activate GPS and Beidou dual-mode tracking, plan optimal transportation routes in real-time on the digital twin platform, and achieve a visualization rate of over 99.8%. |
We've introduced an AR-assisted assembly system for operation end: smart glasses provide 3D interactive guidelines, and force feedback guides key nodes, reducing new employee training by 80%. |
|
| This interactive mode simplifies professional equipment operation with a "what you see is what you get" approach and predictive maintenance for faults, realizing universal application of intelligent equipment. |
A semiconductor firm saw packaging efficiency triple and operator skill requirements drop to high school level with an intelligent solution, showcasing technology's humanistic value. |
|
| We are developing a cutting-edge 3D visualization system, which features a dual-core hardware configuration designed for high-precision spatial management. On one hand, UWB (Ultra-Wideband) chips are integrated into containers—these chips leverage ultra-wideband positioning technology to capture real-time, fine-grained location data of the containers. On the other hand, high-definition 4K monitors serve as the core display terminal, ensuring that the spatial information of the containers is presented with clear, detailed visuals, laying a solid foundation for accurate spatial coordination |
The synergy between UWB chips and 4K monitors endows the 3D visualization system with outstanding performance: the UWB chips enable centimeter-accurate positioning of each container, accurately capturing their spatial coordinates, movement trajectories, and placement status in real time. This precise data is then seamlessly translated into intuitive 3D visuals on the 4K monitors, allowing managers to clearly grasp the overall spatial layout of the containers at a glance. Ultimately, the system realizes efficient, accurate spatial coordination and management of containers, suitable for scenarios such as warehouse inventory scheduling and logistics yard operation optimization
| | |
| The much-anticipated intelligent route optimization function allows supply chain partners to activate GPS and Beidou dual-mode tracking, plan optimal transportation routes in real-time on the digital twin platform, and achieve a visualization rate of over 99.8%. |
We've introduced an AR-assisted assembly system for operation end: smart glasses provide 3D interactive guidelines, and force feedback guides key nodes, reducing new employee training by 80%. |
|
| This interactive mode simplifies professional equipment operation with a "what you see is what you get" approach and predictive maintenance for faults, realizing universal application of intelligent equipment. |
A semiconductor firm saw packaging efficiency triple and operator skill requirements drop to high school level with an intelligent solution, showcasing technology's humanistic value. |
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